07:55 uur 25-01-2021

Mitsui Mining & Smelting Co., Ltd. start massaproductie van HRDP®, een speciale glasdrager voor de volgende generatie halfgeleider verpakking apparaten

Begin van massaproductie en verzending voor een fabrikant van multi-chipmodules in januari 2021

TOKIO– (BUSINESS WIRE) – Voor de commercialisering van HRDP®, een speciale glasdrager voor de volgende generatie halfgeleider verpakking apparaten, Mitsui Mining & Smelting Co., Ltd. (President: Keiji Nishida; hierna “Mitsui Kinzoku”) heeft de oprichting van een systeem voor massaproductie uitgebreid in samenwerking met GEOMATEC Co., Ltd. (President: Kentaro Matsuzaki). Mitsui Kinzoku is verheugd vandaag aan te kondigen dat de massaproductie van HRDP® is gestart voor een binnenlandse fabrikant van multi-chipmodules.

In het persbericht van januari 2018 kondigde Mitsui Kinzoku de ontwikkeling aan van HRDP®, een materiaal voor het creëren van ultrafijne circuits met behulp van een glazen drager voor het Fan Out-paneelniveau-pakket, gebaseerd op de RDL First-methode.

Mitsui Mining & Smelting Co., Ltd. to Initiate Mass Production of HRDP®, a Special Glass Carrier for Next-Generation Semiconductor Packaging Devices

Beginning mass production and shipment for a multi-chip module manufacturer in January 2021

TOKYO–(BUSINESS WIRE)– For the commercialization of HRDP®1, a special glass carrier for the next-generation semiconductor packaging devices, Mitsui Mining & Smelting Co., Ltd. (President: Keiji Nishida; hereinafter, “Mitsui Kinzoku”) has been expanding the establishment of a system for mass production in collaboration with GEOMATEC Co., Ltd. (President: Kentaro Matsuzaki). Mitsui Kinzoku is pleased to announce today that mass production of HRDP® has started for a domestic multi-chip module manufacturer.

In its January 2018 news release, Mitsui Kinzoku announced the development of HRDP®, a material for the creation of ultra-fine circuits using a glass carrier for the Fan Out panel level package, based on the RDL First method2.

HRDP® is a special glass carrier capable of achieving high production efficiency of the Fan Out packages3, the next-generation semiconductor packaging technologies, including ultra-high density circuits designed with a line/space (L/S) ratio of 2/2 μm or less4. Currently, over 20 customers are evaluating HRDP® for commercialization.

As the first stage, mass production for a domestic multi-chip module manufacturer began in January 2021. This customer will use HRDP® to manufacture devices for the 5G market, which is expected to expand in the future, including RF modules5, and other devices for a variety of applications with plans to increase sales.

As the second stage, an overseas leading package manufacturer is planning to adopt HRDP® within FY2021.

In addition, there are plans to initiate the mass production at the other new customers for a variety of applications, such as HPC6 and mobile phones for FY2022 and onward, and the HRDP® market is expected to expand.

Under its slogan of Material Intelligence, Mitsui Kinzoku will realize customers’ wishes to ensure stable quality and sufficient supply, to provide customers with one stop solutions and to endeavor to increase its market share.

Description of Terms
1 Abbreviation of High Resolution De-bondable Panel
2 Re-Distribution Layer First method: Semiconductor chips are packaged after the process of forming the redistribution layer
3 Fan Out Package: Substrate-less packaging technology with ultra-fine re-distribution layer extended outside the chip size
4 L/S=2/2 µm: The line width of 2 µm and the space between neighboring circuit lines of 2 µm.
5 Radio Frequency Module: Product equipped with several active components (IC chips) and passive components (SAW, condenser, resistor and coil) and sealed
6 High Performance Computing: Computer with large-scale, ultra high-speed computing/processing capability

“Development of HRDP® Material for Formation of Ultra-Fine Circuits with Glass Carrier for Fan Out Panel Level Package” (Release as of January 25, 2018)

Video of the RDL First method using HRDP®

Photos/Multimedia Gallery Available: https://www.businesswire.com/news/home/52363593/en


[Contact for inquiries about this release and HRDP® products]
Corporate Communications Department, Mitsui Mining & Smelting Co., Ltd.
TEL: +81-3-5437-8028 E-mail: PR@mitsui-kinzoku.com

[Contact for Inquiries about HRDP® products] (Native language is available.)
In China
Mr. Jordon Jiang
TEL: +86-18601423513 E-MAIL: jordon@evertech.com.tw
In Taiwan
Mr. Alvin Tu
TEL: +886-915973025 E-MAIL: alvin@evertech.com.tw
In Korea
Mr. Suh Jeong Wook
TEL: +82-1053711563 E-MAIL: jwsuh@aj-company.com

Source: Mitsui Mining & Smelting Co., Ltd.


Video of the RDL First method using HRDP®

Exterior photograph of HRDP®, in the 12-inch wafer type (Photo: Business Wire)

HRDP® product diagram, in the wafer type (Graphic: Business Wire)

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