PORTLAND, Ore.–(BUSINESS WIRE)– Lattice Semiconductor Corporation (NASDAQ:LSCC), de toonaangevende aanbieder van op maat gemaakte smart-connectiviteit, heeft vandaag aangekondigd zijn met Lattice CrossLink™ programmeerbare ASSP-systemen (pASSP) uit te breiden, zodat het nieuwe overbruggingsfuncties voor video faciliteert. Dit gebeurt met de lancering van drie CrossLink-patenten en twee demonstratieplatforms voor de omzetting van MIPI® DSI naar LVDS en CMOS naar MIPI CSI-2. Lattice onderstreept zijn inzet voor overbruggende oplossingen tussen applicaties voor particulieren, de industrie en de auto-industrie. Daarom heeft het bestaand intellectueel eigendom van CrossLink geoptimaliseerd, om logische bronnen te bewaren en energieverbruik te verlagen.
Lattice Semiconductor Expands CrossLink Programmable ASSP (pASSP) IP Solutions
PORTLAND, Ore.–(BUSINESS WIRE)– Lattice Semiconductor Corporation (NASDAQ:LSCC), the leading provider of customizable smart connectivity solutions, today announced the expansion of its Lattice CrossLink™ programmable ASSP (pASSP) solutions to enable new video bridging capabilities with the release of three new CrossLink intellectual property (IP) and two new CrossLink demonstration platforms showcasing MIPI® DSI to LVDS and CMOS to MIPI CSI-2. Reinforcing Lattice’s commitment to provide bridging solutions for consumer, industrial, and automotive applications, the company has optimized existing CrossLink IP to save logic resources and lower power consumption.
This Smart News Release features multimedia. View the full release here: http://www.businesswire.com/news/home/20170221005158/en/
The CrossLink product was designed to address the challenges of today’s rapidly changing I/O landscape by offering designers a new way to develop high performance, low power and compact bridging solutions. Since the product introduction less than a year ago, Lattice has seen strong interest from customers to expand beyond typical early applications of the CrossLink product for simple interface conversion, merging and muxing of image sensors, application processors and displays.
By optimizing existing IP, leveraging new IP and development platforms, along with additional resources, Lattice can offer more solutions for a greater variety of bridging applications that captures the best of both worlds with the combined the flexibility and fast time to market of an FPGA and the power and functional optimization of an ASSP.
“The new CrossLink IP and solutions will enable our customers to adopt cameras and displays with the latest mobile interface technology to reduce overall system cost, power and size, while accelerating the design cycle of their next-generation products,” said C.H. Chee, senior director of marketing, mobile & consumer division at Lattice Semiconductor. “As inventors of the first programmable bridging device, and the world’s fastest MIPI D-PHY bridging device, Lattice is committed to delivering a low cost bridging solution with the highest bandwidth, lowest power and smallest footprint.”
Key features of the new CrossLink pASSP IP solutions include:
New Technology Demonstration Platforms
CrossLink evaluation boards with the new IPs are available now from Lattice and its distributors. To learn more, please visit www.latticesemi.com/CrossLink.
About Lattice Semiconductor
Lattice Semiconductor (NASDAQ: LSCC) provides smart connectivity solutions powered by our low power FPGA, video ASSP, 60 GHz millimeter wave, and IP products to the consumer, communications, industrial, computing, and automotive markets worldwide. Our unwavering commitment to our customers enables them to accelerate their innovation, creating an ever better and more connected world.
Lattice Semiconductor Corporation, Lattice Semiconductor (& design), and CrossLink and specific product designations are either registered trademarks or trademarks of Lattice Semiconductor Corporation or its subsidiaries in the United States and/or other countries.
MIPI is a licensed trademark of MIPI, Inc. in the U.S. and other jurisdictions.
GENERAL NOTICE: Other product names used in this publication are for identification purposes only and may be trademarks of their respective holders.